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NB4N11MDTEVB
PACKAGE DIMENSIONS
Micro ? 10
CASE 846B ? 03
ISSUE D
PIN 1 ID
K
G
? A ?
? B ?
D 8 PL
0.08 (0.003)
M
T B
S
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE
BURRS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846B ? 01 OBSOLETE. NEW STANDARD
846B ? 02
MILLIMETERS
INCHES
DIM
MIN MAX
MIN MAX
A
2.90 3.10
0.114
0.122
B
C
D
2.90 3.10
0.95 1.10
0.20 0.30
0.114 0.122
0.037 0.043
0.008 0.012
0.038 (0.0015)
C
G
H
0.50 BSC
0.05 0.15
0.020 BSC
0.002 0.006
? T ? SEATING
PLANE
H
J
L
J
K
L
0.10 0.21
4.75 5.05
0.40 0.70
0.004 0.008
0.187 0.199
0.016 0.028
SOLDERING FOOTPRINT*
10X
1.04
0.041
3.20
0.126
0.32
0.0126
4.24
0.167
10X
5.28
0.208
8X
0.50
0.0196
SCALE 8:1
mm
inches
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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